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8-PIN SOIC SURFACE MOUNT~ D, DP PACKAGE SUFFIX
DIMENSIONS
  INCHES MILLIMETERS
MIN MAX MIN MAX
A .228 .244 5.80 6.20
A1 .150 .158 3.80 4.00
B .189 .196 4.80 4.98
C .053 .069 1.35 1.75
C1 .004 .009 0.10 0.23
E .050 BSC 1.27 BSC
F .014 .019 0.35 0.48
G .007 .010 0.19 0.25
H .016 .035 0.41 0.89
{short description of image} 0° 8° 0° 8°
MA2126
NOTES:
#1 'A1' AND 'B' DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 IN. PER SIDE.
2. LEADS SHALL BE COPLANAR WITHIN 0.004 IN. AT THE SEATING PLANE.
#3 THE BASIC LEAD SPACING IS 0.050 IN. BETWEEN CENTERLINES. EACH LEAD CENTERLINE SHALL BE LOCATED WITHIN ±0.004 IN. OF ITS EXACT TRUE POSITION.
4. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
#5 DIMENSION 'F' DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED 'F' MAXIMUM BY MORE THAN 0.003 IN. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT.
#6 THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.004 IN. AND 0.010 IN. FROM THE LEAD TIP.
#7 'C1' IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY (BASE PLANE).