NTC electronic components and advanced technologies. Autex SPb
Mechanical Drawings

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20-PIN SSOP ~ M PACKAGE SUFFIX
DIMENSIONS
  INCHES MILLIMETERS
MIN MAX MIN MAX
A .053 .069 1.35 1.42
A1 .004 .010 .10 .25
A2 - .059 - 1.50
b .008 .012 .20 .30
C .007 .010 .18 .25
D .337 .344 8.56 8.74
E .228 .244 5.79 6.20
E1 .150 .157 3.81 3.99
e .025 BSC .635 BSC
K .058 REF 1.47 REF
L .016 .050 .41 1.27
{short description of image} 0° 8° 0° 8°
ma2160
NOTES:
1. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
{short description of image} ‘D’ AND ‘E1’ DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006 IN PER SIDE.
{short description of image} THE BASIC LEAD SPACING IS 0.025 IN. BETWEEN CENTERLINES. EACH LEAD CENTERLINE SHALL BE LOCATED WITHIN ±0.004 IN. OF ITS EXACT TRUE POSITION.
4. LEADS SHALL BE COPLANAR WITHIN 0.004 IN. AT THE SEATING PLANE.
{short description of image} DIMENSION ‘b’ DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED ‘b’ MAXIMUM BY MORE THAN 0.003 IN. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT.
{short description of image} THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.004 IN. AND 0.010 IN. FROM THE LEAD TIP.
{short description of image} ‘A1’ IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY (BASE PLANE).

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