NTC electronic components and advanced technologies. Autex SPb
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64-PIN MQFP ~ FP PACKAGE SUFFIX
DIMENSIONS
  MILLIMETERS INCHES
MIN MAX MIN MAX
A - 3.40 - 0.13
A1 0.25 0.50 0.0098 0.020
A2 2.50 2.90 0.098 0.11
b 0.29 0.45 0.011 0.018
b1 0.29 0.41 0.011 0.016
C 0.11 0.23 0.0043 0.0091
C1 0.11 0.19 0.0043 0.0074
D 17.20 BSC 0.67 BSC
D1 14.00 BSC 0.55 BSC
D2 12.00 REF 0.47 REF
E 17.20 BSC 0.67 BSC
E1 14.00 BSC 0.55 BSC
E2 12.00 REF 0.47 REF
e 0.80 BSC 0.031 BSC
L 0.73 1.03 0.029 .012
L1 0.25 BSC 0.0098 BSC
{short description of image} 0° 7° 0° 7°
ma2161
NOTES:
1. CONTROLLING DIMENSION: MILLIMETERS. INCHES SHOWN FOR REFERENCE ONLY.
{short description of image} ‘D1’ AND ‘E1’ DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.25mm PER SIDE. ‘D1’ AND ‘E1’ INCLUDE MOLD MISMATCH.
{short description of image} THE BASIC LEAD SPACING IS 0.80mm BETWEEN CENTERLINES. EACH LEAD CENTERLINE SHALL BE LOCATED WITHIN ±0.10mm OF ITS EXACT TRUE POSITION.
4. LEADS SHALL BE COPLANAR WITHIN 0.08mm AT THE SEATING PLANE.
{short description of image} DIMENSION ‘b’ DOES NOT INCLUDE DAMBAR PROTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE LEAD WIDTH TO EXCEED ‘b’ MAXIMUM BY MORE THAN 0.08mm. DAMBAR CAN NOT BE LOCATED ON THE LOWER RADIUS OR THE LEAD FOOT.
{short description of image} DETAILS OF PIN1 IDENTIFIER ARE OPTIONAL BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
{short description of image} EXACT SHAPE AND SIZE OF THIS FEATURE IS OPTIONAL.
{short description of image} THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN 0.10mm AND 0.25mm FROM THE LEAD TIP.
{short description of image} ‘A1’ IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY (BASE PLANE).