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24-PIN CERAMIC DIP ~ J PACKAGE SUFFIX
DIMENSIONS  
  INCHES MILLIMETERS NOTES
MIN MAX MIN MAX  
A 0.590 0.625 14.99 15.88 7
A1 0.515 0.605 13.08 15.37 4
B 1.180 1.260 29.97 32.00 4
C - 0.225 - 5.72  
D 0.015 0.055 0.38 1.40 3
E 0.014 0.026 0.36 0.66 8
E1 0.045 0.065 1.14 1.65 2
F 0.008 0.018 0.20 0.46 8
G 0.100 BSC 2.54 BSC 5
H 0.005 0.065 0.127 1.65 6
J 0.125 0.200 3.18 5.08  
{short description of image} 0° 15° 0° 15°  
MA2023
NOTES:
1. INDEX AREA: A NOTCH OR A PIN ONE IDENTIFICATION MARK SHALL BE LOCATED ADJACENT TO PIN ONE. THE MANUFACTURER'S IDENTIFICATION SHALL NOT BE USED AS A PIN ONE IDENTIFICATION MARK.
2. THE MINIMUM LIMIT FOR DIMENSION 'E1' MAY BE 0.023 (0.58mm) FOR LEADS NUMBER 1, 12, 13 AND 24 ONLY.
3. DIMENSION 'D' SHALL BE MEASURED FROM THE SEATING PLANE TO THE BASE PLANE.
4. THIS DIMENSION ALLOWS FOR OFF-CENTER LID, MENISCUS AND GLASS OVERRUN.
5. THE BASIC PIN SPACING IS 0.100 (2.54mm) BETWEEN CENTERLINES. EACH PIN CENTERLINE SHALL BE LOCATED WITHIN ±0.010 (0.25mm) OF ITS EXACT TRUE POSITION.
6. APPLIES TO ALL FOUR CORNERS (LEADS NUMBER 1, 12, 13 AND 24).
7. DIMENSION 'A' SHALL BE MEASURED AT THE CENTERLINE OF THE LEADS WHEN{short description of image}{short description of image}= 0°.
8. THE MAXIMUM LIMITS OF DIMENSIONS 'E' AND 'F' SHALL BE MEASURED AT THE CENTER OF THE FLAT WHEN SOLDER DIP IS APPLIED.
9. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
{short description of image} THE SEATING PLANE IS LOCATED AT THE LOWEST POINT ON THE LEAD AT WHICH THE LEAD WIDTH EXCEEDS 0.040 (1.02mm) MINIMUM, EXCLUDING ANY HALF LEADS AT THE PACKAGE ENDS.