NTC electronic components and advanced technologies. Autex SPb
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16-PIN CERAMIC DIP ~ J PACKAGE SUFFIX
DIMENSIONS  
  INCHES MILLIMETERS NOTES
MIN MAX MIN MAX  
A 0.290 0.320 7.37 8.13 7
A1 0.220 0.310 5.59 7.87 4
B - 0.840 - 21.34 4
C - 0.200 - 5.08  
D 0.015 0.060 0.38 1.52 3
E 0.014 0.026 0.36 0.66 8
E1 0.045 0.065 1.14 1.65 2
F 0.008 0.018 0.20 0.46 8
G 0.100 BSC 2.54 BSC 5
H 0.005 - 0.13 - 6
J 0.125 0.200 3.18 5.08  
{short description of image} 0° 15° 0° 15°  
MA2025
NOTES:
1. INDEX AREA: A NOTCH OR A PIN ONE IDENTIFICATION MARK SHALL BE LOCATED ADJACENT TO PIN ONE. THE MANUFACTURER'S IDENTIFICATION SHALL NOT BE USED AS A PIN ONE IDENTIFICATION MARK.
2. THE MINIMUM LIMIT FOR DIMENSION 'E1' MAY BE 0.023 (0.58mm) FOR LEADS NUMBER 1, 8, 9 AND 16 ONLY.
3. DIMENSION 'D' SHALL BE MEASURED FROM THE SEATING PLANE TO THE BASE PLANE.
4. THIS DIMENSION ALLOWS FOR OFF-CENTER LID, MENISCUS AND GLASS OVERRUN.
5. THE BASIC PIN SPACING IS 0.100 (2.54mm) BETWEEN CENTERLINES. EACH PIN CENTERLINE SHALL BE LOCATED WITHIN ±0.010 (0.25mm) OF ITS EXACT TRUE POSITION.
6. APPLIES TO ALL FOUR CORNERS (LEADS NUMBER 1, 8, 9 AND 16).
7. DIMENSION 'A' SHALL BE MEASURED AT THE CENTERLINE OF THE LEADS WHEN{short description of image}{short description of image}= 0°.
8. THE MAXIMUM LIMITS OF DIMENSIONS 'E' AND 'F' SHALL BE MEASURED AT THE CENTER OF THE FLAT WHEN SOLDER DIP IS APPLIED.
9. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
{short description of image} THE SEATING PLANE IS LOCATED AT THE LOWEST POINT ON THE LEAD AT WHICH THE LEAD WIDTH EXCEEDS 0.040 (1.02mm) MINIMUM, EXCLUDING ANY HALF LEADS AT THE PACKAGE ENDS.