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28-PIN CERAMIC LEADLESS SURFACE MOUNT ~ L PACKAGE SUFFIX
DIMENSIONS  
  INCHES MILLIMETERS NOTES
MIN MAX MIN MAX  
A .060 .100 1.52 2.54 6
A1 .050 .088 1.27 2.24  
B1 .022 .028 0.56 0.71 1,3
B2 .072 REF. 1.83 REF.  
B3 .006 .022 0.15 0.56 8
D/E .442 .460 11.23 11.68  
D1/E1 .300 BSC 7.62 BSC  
D2/E2 .150 BSC 3.81 BSC  
D3/E3 - .460 - 11.68 4
L .045 .055 1.14 1.40  
L1 .045 .055 1.14 1.40  
L2 .075 .095 1.90 2.41 5
L3 .003 .015 0.08 0.38  
N 28 28 2
ND/NE 7 7 2
e .050 BSC 1.27 BSC 10
MA2063
NOTES:
1. A MINIMUM CLEARANCE OF 0.015 IN. (0.38mm) SHALL BE MAINTAINED BETWEEN ADJACENT TERMINALS.
2. 'N' IS THE MAXIMUM QUANTITY OF TERMINAL POSITIONS. 'ND' AND 'NE' ARE THE NUMBERS OF TERMINALS ALONG THE SIDES OF LENGTH 'D' AND 'E' RESPECTIVELY.
3. ELECTRICAL CONNECTION TERMINALS ARE REQUIRED ON PLANE 1 AND OPTIONAL ON PLANE 2. HOWEVER, IF PLANE 2 HAS SUCH TERMINALS THEY SHALL BE ELECTRICALLY CONNECTED TO OPPOSING TERMINALS ON PLANE 1.
4. A MINIMUM CLEARANCE OR 0.015 IN. (0.38mm) SHALL BE MAINTAINED BETWEEN A METAL LID AND OTHER METAL FEATURES (E.G., PLANE 2 TERMINALS, METALLIZED CASTELLATIONS, ETC.) THE LID SHALL NOT EXTEND BEYOND THE EDGES OF THE BODY.
5. THE INDEX FEATURE FOR NUMBER 1 TERMINAL IDENTIFICATION, OPTIONAL ORIENTATION OR HANDLING PURPOSES SHALL BE WITHIN THE AREA DEFINED BY DIMENSIONS 'B2' AND 'L2' ON PLANE 1.
6. DIMENSION 'A' CONTROLS THE OVERALL PACKAGE THICKNESS.
7. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
8. CASTELLATIONS ARE REQUIRED ON BOTTOM TWO LAYERS. CASTELLATIONS IN THE TOP LAYER ARE OPTIONAL.
9. WHEN SOLDER DIP LEAD FINISH APPLIES, SOLDER BUMP HEIGHT SHALL NOT EXCEED 0.007 INCHES AND SOLDER BUMP COPLANARITY SHALL NOT EXCEED 0.006 INCHES.
10. THE BASIC TERMINAL SPACING IS 0.050 INCHES BETWEEN CENTERLINES. EACH TERMINAL CENTERLINE SHALL BE LOCATED WITHIN ±0.004 INCHES OF ITS EXACT TRUE POSITION.