NTC electronic components and advanced technologies. Autex SPb
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28-PIN CERAMIC LEADLESS SURFACE MOUNT ~ LP PACKAGE SUFFIX
DIMENSIONS
  INCHES MILLIMETERS
MIN MAX MIN MAX
A .060 .100 1.52 2.54
A1 .050 .088 1.27 2.24
B1 .022 .028 0.56 0.71
B3 .006 .022 0.15 0.56
D/E .442 .458 11.23 11.63
D1/E1 .300 BSC 7.62 BSC
D2/E2 .150 BSC 3.81 BSC
D3/E3 - .460 - 11.68
L .075 REF 1.905 REF
L1 .045 .055 1.14 1.40
L3 .003 .013 0.08 0.33
N 28 28
ND/NE 7 7
O .006 REF 0.152 REF
P .040 REF 1.016 REF
Q .020 REF 0.508 REF
e .050 BSC 1.27 BSC
mb2135
NOTES:
1. A MINIMUM CLEARANCE OF 0.015 IN. (0.38mm) SHALL BE MAINTAINED BETWEEN ADJACENT TERMINALS.
{short description of image} 'N' IS THE MAXIMUM QUANTITY OF TERMINAL POSITIONS. 'ND' AND 'NE' ARE THE NUMBERS OF TERMINALS ALONG THE SIDES OF LENGTH 'D' AND 'E' RESPECTIVELY.
{short description of image} ELECTRICAL CONNECTION TERMINALS ARE REQUIRED ON PLANE 1 AND OPTIONAL ON PLANE 2. HOWEVER, IF PLANE 2 HAS SUCH TERMINALS THEY SHALL BE ELECTRICALLY CONNECTED TO OPPOSING TERMINALS ON PLANE 1.
{short description of image} A MINIMUM CLEARANCE OR 0.015 IN. (0.38mm) SHALL BE MAINTAINED BETWEEN A METAL LID AND OTHER METAL FEATURES (E.G., PLANE 2 TERMINALS, METALLIZED CASTELLATIONS, ETC.) THE LID SHALL NOT EXTEND BEYOND THE EDGES OF THE BODY.
5. THE INDEX FEATURE FOR NUMBER 1 TERMINAL IDENTIFICATION ON PLANE 1 IS DEFINED BY DELETION OF THE THERMAL PAD AJACENT TO TERMINAL 1.
{short description of image} DIMENSION 'A' CONTROLS THE OVERALL PACKAGE THICKNESS.
7. CONTROLLING DIMENSION: INCHES. MILLIMETERS SHOWN FOR REFERENCE ONLY.
8 CASTELLATIONS ARE REQUIRED ON BOTTOM TWO LAYERS. CASTELLATIONS IN THE TOP LAYER ARE OPTIONAL.
9. WHEN SOLDER DIP LEAD FINISH APPLIES, SOLDER BUMP HEIGHT SHALL NOT EXCEED 0.007 INCHES AND SOLDER BUMP COPLANARITY SHALL NOT EXCEED 0.006 INCHES.
{short description of image} THE BASIC TERMINAL SPACING IS 0.050 INCHES BETWEEN CENTERLINES. EACH TERMINAL CENTERLINE SHALL BE LOCATED WITHIN ±0.004 INCHES OF ITS EXACT TRUE POSITION.
11 PLANE 1 IS THE HEAT RADIATION SURFACE. THIS SURFACE IS METALIZED WITH A CHECKERBOARD PATTERN OF THERMAL CONDUCTION PADS. THE PAD CENTERLINES ARE ALIGNED WITH TERMINAL CENTERLINES. THERMAL PADS ARE NOT ELECTRICALLY TIED TO ANY TERMINAL.