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Quality Statement

Customer Notification Quality and Reliability Assurance
Die and Wafers Total Business Excellence Policy
Product Classification Status Unitrode's Commitment to Quality

 Product Classification Status

The following definitions apply to describe Unitrode’s current product production status. Unitrode also reserves the right to make changes without further notice in order to improve design performance, reliability, or manufacturability.

CLASSIFICATION PRODUCT STAGE DESCRIPTION
Advance Information Data Sheet Formative or Design This document contains the design specifications for product under development. Specifications may be changed in any manner without notice.
Preliminary Data Sheet First Production Supplementary data may be published at a later date. Unitrode reserves the right to make changes at any time without notice, in order to improve design and supply the best product possible.
No Classification Noted Full Production Product in Full Production

This web site contains complete data sheet information about Unitrode’s integrated circuits for Commercial, Industrial and Military/Aero applications. It includes all our latest new products including products that will be introduced throughout the year 1998.

For more information about any new products or any of Unitrode service capabilities, please call, write or fax.

Unitrode's Commitment to Quality

Quality, reliability, and innovation are the hallmarks of our products! Everything Unitrode does aims at providing to our customers the highest levels of quality, reliability and customer satisfaction available in the marketplace. These are the keys to "Building Customer Loyalty," the theme of our quality program.

These achievements do not happen by chance. Our accomplishments have come from a strong and sustained commitment to Total Business Excellence. We demonstrate our commitment with our TBE Policy Statement.

Total Business Excellence Policy

Unitrode pledges to satisfy our customers’, employees’, and stakeholders’ expectations in all business activities. We are committed to achieving this through Total Business Excellence. This means:

  • We actively support and enable a Total Business Excellence environment.
  • We perform our work with the highest level of quality workmanship.
  • We make decisions based on the analysis of data.
  • We perform our work in a controlled and disciplined manner.
  • We make decisions that build customer loyalty.
  • We solve problems to their root cause in a timely manner.
  • We foster empowerment and teamwork.
  • We continuously improve our performance.
  • We assure our quality system provides value to our company and to our customers.
  • We routinely self assess Total Business Excellence for effectiveness.
  • We continually improve Total Business Excellence.

Quality and Reliability Assurance

The foundation of our commitment begins with our effective Quality Assurance System. In the October of 1992, Unitrode Corporation became one of the first in our industry to achieve IS/ISO 9001/EN 29001 Registration. Currently, Unitrode’s quality assurance system exceeds the rigorous requirements of ISO 9001-1994 and MIL-PRF-38535.

In August of 1996, the Defense Supply Center-Columbus (DSCC) granted Unitrode full Q-Level certification to MIL-PRF-38535 for listing on the Qualified Manufacturers List (QML). In addition, DSCC continued Unitrode’s laboratory suitability by certifying that our test methods are performed in accordance with MIL-STD-883.

All Unitrode’s products and processes that are used to manufacture our products meet extensive qualification requirements before shipping to customers. Qualification ensures:

  • Customer and/or design requirements are translated efficiently into manufacturing requirements;
  • That all groups are integrated, coordinated and capable;
  • Our processes are manufacturable;
  • Our products meet or exceed the reliability requirements of our customers.

Process Qualification

When a process qualification is required, Quality Assurance organizes a cross functional team who prepares and completes a formal qualification plan per QP 2515. Key require-ments for major processes include: documented design rules and process specifications; process and device simulation with full SPICE models; completed process control plan with identified critical, significant and non-critical characteristics; implemented process control charts; demonstrated Cp, and Cpk for significant and critical characteristics; documented out of control action plans (OCAPs); completed quality audit; process acceptance criteria; Gage R&R studies; construction analyses; and extensive reliability testing.

Our extensive reliability requirements ensure our new processes demonstrate a 200 FIT (calculated @70 degrees C, .7 eV activation energy, 60% confidence) or better at the time of qualification using a minimum of 3 wafer lots. Figure-1 provides typical reliability tests that are performed for new major processes.

Package Qualification

Whenever a new package is introduced, in addition to qualifying the manufacturing process using requirements appropriate to assembly processing, Unitrode performs a complete battery of reliability tests. Figure-2 depicts typical requirements for plastic packages. Figure-3 presents the requirements for hermetic packages.

Product Qualification

New products must be manufactured using qualified processes and packages. Unitrode’s new product qualification consists of 2 major milestones: Release For Introduction (RFI) and Release to Production (RTP). RFI is the term Unitrode uses to describe devices that: are built on a qualified process; meet the preliminary data sheet over the specified temperature range; demonstrate no infant mortality; have been verified in the appropriate application; had ESD measured and classified; have a released preliminary test program.

Devices which achieve RTP meet all the RFI requirements plus additional requirements and completes Unitrode’s product qualification. Typical RTP requirements include: bench and temperature characterization; demonstrated compliance to all datasheet parameters; meet Cp, Cpk targets for all untrimmed parameters in datasheet; test program complete and released to production; machine capability less than 5% of the device specification range; test schematic(s), test program(s), bonding diagram(s), burn-in diagrams approved and released; ESD measured and classified (human body model); passed latch-up and HTOL test to 1000 hrs; and, final data sheet approved and released.

Results

As a result of our comprehensive qualification procedures, we are able to report long-term device reliability of 4.0 FITs or lower failure rates for combined functional families. This is estimated through the accumulation of millions of hours of life testing at accelerated temperatures.

Failure Analysis

If we do experience a failure during pre-production qualification, we have an extensive failure analysis lab to determine and fix the root cause before they ever reach our customers. We begin by verifying the failure to published specifications. We provide written failure verification to our customers within 72 hours.

This is followed by failure mode identification through laboratory analyses such as electrical measurements, optical and electron microscopy, radiography, device depro-cessing, microsectioning, spectrometry and cholesteric liquid crystal analysis. Unitrode maintains a 10 day cycle to identify moderately complex failures from receipt of failed units. If needed, closed loop corrective action is managed through our Corrective Action Continuous Improvement Team using the 8D approach.

Customer Notification

Our commitment to continuous improvement does introduce occasional process and product changes. When we need to introduce a change, Unitrode issues a customer notification. Our policy is to provide a 90 day notification whenever possible. We provide customer notification when: a waiver to a customer’s or Unitrode’s specification is needed prior to shipment of material deemed suitable for shipment by Unitrode or our customer; any product, process or mask change that requires a change to Unitrode’s data sheet, SCD, Purchase Order or customer specification; any product, process or mask change that reduces ESD rating; a change in manufacturing location including: wafer fabrication, assembly, and test; there is a change in wafer starting material, dieletric, passivation or metalization materials and certain assembly materials; a major change to manufacturing process change on a critical or significant characteristic according to our process control plan(s); a manufacturing process change to a characteristic that is determined to be a reliability concern; or, a significant change to Unitrode’s operating procedures or quality systems.

Total Business Excellence

Unitrode recognizes that true Total Business Excellence (TBE) goes well beyond the scope of Quality Assurance. A company demonstrating Total Business Excellencemust have more rigorous business practices than industry standards and a supporting culture to enable and improve these practices.

The aim of the TBE process is business excellence and continuous improvement. It is a never ending search for ways to improve everything we do, and a pledge to ultimately translate improvements into better products and services for our customers.

Our goals include: improved designs that meet the broadest spectrum of application needs; improved translation of customer requirements into actual product performance characteristics; improved understanding of process capabilities to improve the product introduction process; higher productivity; less scrap and rework; and lower production costs.

For example, Unitrode internal qualification procedures now include rigorous qualification of our suppliers, subcontractors, and the wafer fabrication (both major new processes and unit processes). Each qualification is managed by a cross functional Qual Team. Qualification requirements include detailed and advanced process control plans, out-of-control action plans (OCAPs), demonstrated process capability, advance statistical process control techniques and Gage R&R studies.

We’ve improved many of our internal practices, for example: shop floor control, document management, customer notification and corrective action. We’ve replaced our old hardcopy systems with electronically based systems using state-of-the art software systems and relational databases.

Total Business Excellence impacts each and every department, each and every activity, and each and every product from initial concept to end use installation and operation. All of these reasons are why we deliver high quality and reliable products. Our continuing quest for ways to improve everything we do yields better and more reliable products and services for our customers. This is what earns customer loyalty!

Die and Wafers

Description

Unitrode offers most of our products in die and/or wafer form through our die distributors. Unitrode’s die utilize either linear bipolar or BiCMOS process technology featuring tight beta controls and resistor matching techniques.

Die thickness is either 12 mils or 15 mils, +/- 1 mil. Interconnects are an alloy of copper and aluminum (to reduce the possibility of electromigration). Most product’s backside material is pure silicon.

Testing

All products are tested at two separate points: (1) wafer process parameter in-line probing and (2) ambient electrical test probing. Die are tested to full data sheet specifications, with the exception of some high power or high speed devices where production probe equipment limit the test environment.

Inspection

Unitrode performs visual inspections on military grade die to MIL-STD-883, Method 2010, conditions A or B, or to individual customer specifications. Die is supplied in "waffle pack" or single wafer form. Standard wafers are 100 mils, generic 4- or 6-inch diameter.

Ordering

Product is available from Unitrode’s authorized die distributors, and part numbers end with the suffix "c" for chip form or "chipwfr" for wafer form.


Last updatd: 06/30/98